Browsing by Author "Solanki, Dhaivat J."
Now showing 1 - 2 of 2
- Results Per Page
- Sort Options
Item Electroless Atomic Layer Deposition(2017-12) Solanki, Dhaivat J.; Brankovic, Stanko R.; Robles Hernandez, Francisco C.; Bao, JimingThin film growth is studied by many researchers because of broad applications and significant impact on technological development in modern era. However, thin film nucleation and growth is challenging task for many materials with high surface energy and melting temperature. Such systems tend to grow 3D leading to non-uniform coverage and rough surface. This poses an issue when very thin film deposition is required with 2D morphology and full coverage of deposit is desired. In this thesis, we propose a protocol for aqueous solution based thin film deposition where deposit thickness is precisely controlled down to a monolayer. We demonstrate combination of electroless monolayer formation and Surface Limited Redox Replacement to deposit thin film selectively on Cu nanowires and polycrystalline Cu wafer irrespective of another metal and oxide surrounding. Such protocol expands a new horizon in the field of precise ultrathin film deposition.Item Electroless Atomic Layer Deposition of Pt on Cu Nanowires(2017) Solanki, Dhaivat J.; Brankovic, Stanko R.Pt is a material widely used as a catalyst in many areas of chemical synthesis and energy conversion and as a protective layer and etch stop barrier in the semiconductor industry. Due to high surface free energy, Pt exhibits a rough 3D growth (Volmer – Weber) mode. This represents a challenge when ultrathin and conformal layers of Pt are needed. The electroless ALD process presented here enables uniform and selective deposition of Pt on micro patterned Cu structures/wires on Si and SiO2, offering an opportunity for simplified integration into more complex fabrication routes currently used in semiconductor fabs. Outline of the process: Pt is deposited on Cu lines by surface limited redox replacement (SLRR). Monolayer of Pb is deposited on Cu/Pt using an ‘electro-less’ approach utilizing V2/3+ redox couple. Pb monolayer on Cu/Pt serves as a reducing agent for Pt deposition (self-limited to 1 ML).