Permeability Spectra of Electrodeposited CoFe Film for Inductor Applications
Thin film electronic components play a crucial role in integrated circuits, enabling miniaturization in the semiconductor industry. With the continuous demand for smaller devices, the manufacturing of passive components like inductors and voltage regulators presents challenges. Research trends have focused on RF and power electronics applications for Micro Electromechanical Devices (MEMs), with promising growth in biomedical, neurotechnology, and wireless/sensor applications. Power control techniques, such as dynamic voltage and frequency scaling (DVFS), enhance system efficiency by adjusting clock frequency and voltage based on computational load. Integrated voltage regulators, particularly fully integrated voltage regulators (FIVRs), are essential for DVFS implementation, leading to the development of new magnetic materials. Achieving miniaturization with FIVRs is crucial, as conventional voltage regulators occupy a significant portion of motherboard space. The use of FIVRs reduces losses associated with larger circuit sizes and longer connections. The implementation of FIVRs in processors has significantly improved power efficiency. To fabricate FIVRs, the development of miniaturized inductors is vital. Traditional materials like ferrites are unsuitable due to their low stability frequency. Thin film alloy deposition methods, such as electrodeposition, offer scalability and cost efficiency. This thesis investigates the influence of electrochemical process parameters and substrate materials on the permeability spectra of thin film CoFe alloys. The analysis involves methodologies such as SEM-EDS, EQCMB, a 4-point probe, and VNA.